Research Institute of Electrical Communication Tohoku University

MENU

Subject:2nd CIES Technology Forum

Date:March 17-18, 2016

Place:CIES, Tohoku Univ、International Research Institute of Disaster Science (IRIDeS), Tohoku Univ、Sendai Kokusai Hotel


2nd CIES Technology Forum (March 17–18, 2016)

Center for Innovative Integrated Electronic Systems (CIES) (http://www.cies.tohoku.ac.jp/english/), Tohoku University has conducted the activities under the mission of creating innovative devices, and its integrated electronic systems through the international collaboration among industries, universities and government for contributing to the field of next-generation integrated electronics systems. 2nd CIES Technology Form (http://www.cies.tohoku.ac.jp/2nd_forum/) will be held to introduce the activities of CIES for contributing the recovery and new creation after the Great East Japan Earthquake.

 

2nd CIES Technology Forum, Tohoku University

Time & date, venue:

March 17, 2016

10:30–17:45  Day I International Symposium (Language: English)

                          International Research Institute of Disaster Science (IRIDeS), Tohoku Univ.*

18:30             Banquet

                         Sendai Kokusai Hotel

March 18, 2016

 9:30–16:20   Day II Progress Report (Language: Japanese)

          International Research Institute of Disaster Science (IRIDeS), Tohoku Univ.*

16:40–18:00  CIES Lab Tour (Language: Japanese)

                         CIES, Tohoku Univ.

*Aramaki Aza-Aoba 468-1, Aoba-ku, Sendai 980-0845 JAPAN (About 3min walk from CIES)

Registration fee: Free (Banquet 7,000JPY)

Registration (http://www.cies.tohoku.ac.jp/2nd_forum/)

Date :
March 17–18, 2016
Place :
CIES, Tohoku Univ、International Research Institute of Disaster Science (IRIDeS), Tohoku Univ、Sendai Kokusai Hotel