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International Activities

Summary

Many of the staff in RIEC contribute to the development of technology and science in the world by serving as editors of referees of international journals or by chairing or programming international conferences. In some fields in electronics, electrical communications, or information engineering RIEC serves as a Center of Excellence (COE), which attracts researchers and students from all over the world every year. Several academic exchange pro-grams with foreign colleges or institutes are in operation.

International academic exchange programs

University Level Agreements

COUNTRY INSTITUTION DATE OF SIGNING
U.S.A. University of California 1990.3.15
Australia The University of Sydney 1993.1.8
U.S.A.
 Purdue University 1997.9.23
Singapore  National University of Singapore 1997.9.23 
Taiwan National Taiwan University 2000.11.18
Swiss Swiss Federal Institute of Technology, Lausanne 2000.11.20
Korea Korea Advanced Institute of Science and Technology(KAIST) 2001.4.24
Taiwan National Chung Cheng University 2003.11.14
Taiwan National Cheng Kung University 2005.8.9
Taiwan National Yang Ming Chiao Tung University 2005.12.15
Germany The Technische Universitat Dresden 2006.6.26
Canada University of Waterloo 2006.10.30
U.S.A. University of California, Santa Barbara 2007.11.2
U.S.A. University of California, Barkeley 2008.9.1
Canada University of Ottawa 2009.6.26
Germany Berlin Institute of Technology 2009.8.26
Taiwan National Tsing Hua University 2009.12.2
Swiss Swiss Federal Institute of Technology in Zurich 201.7.21
Germany Technische Universität München 2010.8.3
Taiwan National Chengchi University 2011.4.22
Germany Technische Universität Kaiserslautern 2012.2.1
Germany Johannes Gutenberg University of Mainz 2012.2.6
Thailand King Mongkut,s University of Technology Thonburi 2012.11.26
Germany Chemnitz University of Technology 2013.10.31
U.K. University College London, UCL 2013.11.21
Australia The University of Melbourne 2014.11.7
Germany University of Regensburg 2017.3.16
Germany Carl von Ossietzky University Oldenburg 2017.7.13
U.S.A. Rice University 2017.7.21
France University of Lorraine 2018.2.26
Spain University of Salamanca 2018.5.20
China The University of Hong Kong 2019.3.16
Singapore Nanyang Technological University 2019.8.23
Russia St. Petersburg Electrotechnical University　 2019.11.22
France Paris-Saclay University 2020.7.20
Poland University of Warsaw 2021.3.4
Poland Polish Academy of Sciences 2021.7.23
Canada McGill University 2024.6.4 
U.S.A.
 Northeastern University 2025.11.4

Department Level Agreements

COUNTRY INSTITUTION DATE OF SIGNING
Poland Institute of Physics, Polish Academy of Sciences 1976.8.3
Germany IHP-Innovations for High Performance microelectronics 2001.1.22
China Institute of Semiconductors, Chinese Academy of Sciences 2007.4.12
U.S.A WINLAB, Rutgers University 2009.12.9
France Telecom Paris, Institut Polytechnique de Paris 2017.10.25
Taiwan Center for Artificial Intelligence and Advanced Robotics, National Taiwan University 2018.7.31

International Journals in which our faculty members serve on the editorial board

  1. APEX
  2. Auditory Perception & Cognition
  3. Bioengineering
  4. e-Journal of Surface Science and Nanotechnology
  5. Frontiers in Neuroscience
  6. Frontiers in Physics
  7. Frontiers in Psychology
  8. ICT Express
  9. IEEE Transactions on Circuits and Systems for Video Technology (TCSVT)
  10. IEEE Transactions on Magnetics
  11. IEICE Transactions on Communications
  12. IEICE Transactions on Electronics
  13. Japanese Journal of Applied Physics
  14. Journal of Cryptographic Engineering
  15. Journal of Physics D: Applied Physics
  16. Magnetochemistry
  17. Pattern Recognition
  18. Science and Technology of Advanced Materials
  19. Scientific Reports
  20. Spin

International Conferences in which our faculty members served on organizing committee

  1. ACSIN-16
  2. ALC’26
  3. ANFC 2025
  4. Annual Conference on Magnetism and Magnetic Materials 2025
  5. Annual Conference on Magnetism and Magnetic Materials 2026
  6. EM-NANO2025
  7. IEEE HPSR 2025
  8. IEEE ICCCN 2025
  9. IEEE International Conference on Device Technologies for Diversified Application 2025
  10. IEEE International Symposium on Multiple-Valued Logic 2026
  11. International Conference on The Theory and Application of Cryptology and Information Security (ASIACRYPT) 2026
  12. International Magnetics Conference 2026
  13. KJF-ICOMEP2025
  14. Magnetics and Optics Research International Symposium (MORIS) 2026
  15. OptoElectronics and Communications Conference (OECC) 2025
  16. Soft Magnetic Materials Conference (SMM) 2025
  17. TMRC 2025
  18. TMRC 2026
  19. UbiComp 2026

International Exchange